Utilize este identificador para referenciar este registo: http://hdl.handle.net/10400.9/1128
Título: Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
Autor: Sá, A. I. Correia de
Quaresma, S.
Eugénio, S.
Rangel, C. M.
Vilar, Rui
Palavras-chave: Electroless
Ionic Liquids
Thin films
Data: 29-Abr-2010
Citação: Sá, A. I. C.; Quaresma, S.; Eugénio, S.; Rangel, C. M.; Vilar, R. Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes. In: 3º Seminário Internacional de Torres Vedras, Hydogen Enegy and Sustainability-Advances in Fuell Celll and Hyfrogen Workshop, Torres Vedras, April 29-30, 2010, p. 41-44
Resumo: Recent research has suggested a number of applications for gold in fuel cells and related hydrogen fuel processing, which include light weight corrosion resistance bipolar plates and the incorporation of gold as catalyst to provide improvements in electrode conductivity, among others. This paper reports on the electroless deposition of gold on copper substrates from a HAuCl4.3H2O solution in 1-butyl-1- methylpyrrolidinium dicyanamide (BMP-DCA), in laboratory atmospheric conditions. The electrochemical behaviour of the plating solution was studied by potential sweep techniques. Results suggest that gold ions are reduced and deposited on copper without the aid of external polarization, probably by displacement deposition involving copper dissolution, since no other oxidation reaction was identified. Preliminary studies using SEM/EDX showed that compact gold thin films, deposited on copper substrates at 333 K, present a granular nanostructured morphology.
URI: http://hdl.handle.net/10400.9/1128
Aparece nas colecções:UPCH - Comunicações em actas de encontros científicos internacionais

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