Utilize este identificador para referenciar este registo: http://hdl.handle.net/10400.9/2414
Título: Multiscale Copper-uDiamond Nanostructured Composites
Autor: Nunes, D.
Livramento, Vanessa
Fernandes, H.
Silva, C.
Shohoji, Nobumitsu
Correia, J. Brito
Carvalho, P. A.
Palavras-chave: Composites
Extrusion
High energy milling
Microdiamond
Nanodiamond
Data: 2013
Editora: Trans. Tech. Publications
Citação: Nunes, D.; Livramento, V.; Fernandes, H.; Silva, C.; Shohoji, N.; Correia, J.B.; Carvalho, P.A. Multiscale Copper-uDiamond Nanostructured Composites. In: Materials Science Forum, 2013,Vol. 730-732, p. 925-930
Resumo: Nanostructured copper-diamond composites can be tailored for thermal management applications at high temperature. A novel approach based on multiscale diamond dispersions is proposed for the production of this type of materials: a Cu-nDiamond composite produced by high-energy milling is used as a nanostructured matrix for further dispersion of micrometer sized diamond. The former offers strength and microstructural thermal stability while the latter provides high thermal conductivity. A series of Cu-nDiamond mixtures have been milled to define the minimum nanodiamond fraction suitable for matrix refinement and thermal stabilization. A refined matrix with homogenously dispersed nanoparticles could be obtained with 4 at.% nanodiamond for posterior mixture with ƒÝDiamond and subsequent consolidation. In order to define optimal processing parameters, consolidation by hot extrusion has been carried out for a Cu-nDiamond composite and, in parallel, for a mixture of pure copper and ÝDiamond. The materials produced were characterized by X-ray diffraction, scanning and transmission electron microscopy and microhardness measurements.
URI: http://hdl.handle.net/10400.9/2414
ISSN: 1662-9752
Versão do Editor: http://dx.doi.org/10.4028/www.scientific.net/MSF.730-732.925
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