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Gold deposition from 1-butyl-1-methyl-pyrrolidinium dicyanamide ionic liquid at open-circuit and under potentiostatic control
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Orientador(es)
Resumo(s)
In this work, the deposition of gold on copper substrates from solutions of HAuCl4.3H2O in 1-butyl-1-methylpyrrolidinium dicyanamide was studied. Deposition was carried out in open-circuit and under potentiostatic control at temperatures from 293 to 353 K, in normal atmosphere, with deposition conditions allowing water from
atmospheric absorption up to 0.8 wt.%. Films of gold were obtained by both methods. Deposition at open-circuit occurs by galvanic displacement mechanism. Involvement
of Cu+ species in the electrodeposition process was suggested by cyclic voltammetry. Furthermore, copper incorporation in the gold films was confirmed by X-ray diffraction. SEM observation and XRD analysis show that films are nanocrystalline with a globular morphology except for the films formed under potentiostatic control at
353 K, which show a dendritic structure. The size of the crystallites determined by Scherrer's equation varies in the range from 6 to 25 nm.
Descrição
Palavras-chave
Gold Electrodeposition Ionic liquids Open-circuit deposition
Contexto Educativo
Citação
Sá, A.I. Correia de; Eugénio, S.; Quaresma, S.; Rangel, C.M.; Vilar, R. Gold deposition from 1-butyl-1-methyl-pyrrolidinium dicyanamide ionic liquid at open-circuit and under potentiostatic control. In: Surface and Coatings Technology, 2013, Vol. 232, p. 645-651