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Multiscale Copper-uDiamond Nanostructured Composites

2013Journal article Open access
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dc.contributor.authorNunes, D.
dc.contributor.authorLivramento, Vanessa
dc.contributor.authorFernandes, H.
dc.contributor.authorSilva, C.
dc.contributor.authorShohoji, Nobumitsu
dc.contributor.authorCorreia, J.B.
dc.contributor.authorCarvalho, Patricia Almeida
dc.date.accessioned2014-04-15T14:38:48Z
dc.date.available2014-04-15T14:38:48Z
dc.date.issued2013
dc.description.abstractNanostructured copper-diamond composites can be tailored for thermal management applications at high temperature. A novel approach based on multiscale diamond dispersions is proposed for the production of this type of materials: a Cu-nDiamond composite produced by high-energy milling is used as a nanostructured matrix for further dispersion of micrometer sized diamond. The former offers strength and microstructural thermal stability while the latter provides high thermal conductivity. A series of Cu-nDiamond mixtures have been milled to define the minimum nanodiamond fraction suitable for matrix refinement and thermal stabilization. A refined matrix with homogenously dispersed nanoparticles could be obtained with 4 at.% nanodiamond for posterior mixture with ƒÝDiamond and subsequent consolidation. In order to define optimal processing parameters, consolidation by hot extrusion has been carried out for a Cu-nDiamond composite and, in parallel, for a mixture of pure copper and ÝDiamond. The materials produced were characterized by X-ray diffraction, scanning and transmission electron microscopy and microhardness measurements.por
dc.identifier.citationNunes, D.; Livramento, V.; Fernandes, H.; Silva, C.; Shohoji, N.; Correia, J.B.; Carvalho, P.A. Multiscale Copper-uDiamond Nanostructured Composites. In: Materials Science Forum, 2013,Vol. 730-732, p. 925-930por
dc.identifier.issn1662-9752
dc.identifier.urihttp://hdl.handle.net/10400.9/2414
dc.language.isoengpor
dc.publisherTrans. Tech. Publicationspor
dc.relation.publisherversionhttp://dx.doi.org/10.4028/www.scientific.net/MSF.730-732.925por
dc.subjectCompositespor
dc.subjectExtrusionpor
dc.subjectHigh energy millingpor
dc.subjectMicrodiamondpor
dc.subjectNanodiamondpor
dc.titleMultiscale Copper-uDiamond Nanostructured Compositespor
dc.typejournal article
dspace.entity.typePublication
oaire.citation.endPage930por
oaire.citation.startPage925por
oaire.citation.titleMaterials Science Forumpor
oaire.citation.volume730-732por
person.familyNameNunes
person.familyNameSHOHOJI
person.familyNameCorreia
person.familyNamecarvalho
person.givenNameDaniela
person.givenNameNobumitsu
person.givenNameJose B.
person.givenNamepatricia
person.identifier.ciencia-idC118-38FB-6A57
person.identifier.ciencia-idC31C-D617-6377
person.identifier.ciencia-id021E-97A3-F128
person.identifier.orcid0000-0003-3115-6588
person.identifier.orcid0000-0002-9499-7280
person.identifier.orcid0000-0002-8314-0695
person.identifier.orcid0000-0002-5447-0409
person.identifier.ridI-2734-2013
person.identifier.ridA-5751-2012
person.identifier.ridC-1150-2009
person.identifier.scopus-author-id26030595200
person.identifier.scopus-author-id7202364148
person.identifier.scopus-author-id7102859165
rcaap.rightsopenAccesspor
rcaap.typearticlepor
relation.isAuthorOfPublication6317af74-10da-4d1b-b413-028afabcf2c8
relation.isAuthorOfPublicationa3396e58-3598-42de-97a9-9b11f7c2e9d9
relation.isAuthorOfPublication51557bd3-14c6-4246-b185-36f668c061dd
relation.isAuthorOfPublicationf722bc06-dafc-4341-86f8-b405987804a8
relation.isAuthorOfPublication.latestForDiscovery51557bd3-14c6-4246-b185-36f668c061dd

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